
Engineering-driven capability
Heavy copper PCB requires copper thickness control, current carrying design review and process capability to support high-reliability power applications.
Power electronics support with heavy copper capability and thermal design awareness.

Heavy copper PCB requires copper thickness control, current carrying design review and process capability to support high-reliability power applications.
Gerber / ODB++, BOM, Pick & Place, stack-up, quantity, surface finish and test requirements help the team respond faster and more accurately.
These answers help engineering and sourcing teams prepare a more accurate PCB / SMT quotation package.
Please provide Gerber or ODB++, stack-up, BOM, Pick & Place, drawings, quantity, surface finish, test requirements and target lead time.
Our process combines DFM / DFA review, CAM engineering, controlled manufacturing, AOI / SPI / X-Ray inspection and programming or functional test when required.