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PCB Manufacturing Capability

Advanced PCB fabrication capability for high-reliability electronics, from prototype to production.

PCB Capability

1–60 layers PCB manufacturing

YourPCB supports complex PCB requirements with engineering review, material selection and manufacturing guidance.

1–60 Layers
HDI PCB
Multilayer PCB
Heavy Copper PCB
Surface Finish & Solder Mask Color PCB
Special Material PCB
High Aspect Ratio PCB
Aluminum PCB
Flex & Rigid-Flex PCB
Copper & Aluminum Base PCB

PCB electrical testing and production inspection

PCB Production / Inspection

Electrical testing and production inspection help verify open/short circuits, manufacturability and shipment readiness before boards move to SMT assembly or customer delivery.

PCB Process Capability Matrix

Engineering capability from standard production to extreme builds

This capability matrix gives engineering and sourcing teams a clear view of YourPCB’s PCB fabrication window, including materials, line width, BGA pitch, plating, layer count, drilling, registration and special-process capability before RFQ submission.

Capability Item	Standard	Advanced	Extreme / Engineering Review
Materials	FR-4, High-Tg FR-4, Polyimide, Low Dk, BT-Resin	FR-4, High-Tg FR-4, Polyimide, Low Dk, BT-Resin, PTFE	FR-4, High-Tg FR-4, Polyimide, Low Dk, BT-Resin, PTFE
Impedance control tolerance	±10%	±8%	±5%
Inner layer line width	0.003" / 0.075mm	0.0024" / 0.06mm	0.0016" / 0.04mm
Outer layer line width	0.0036" / 0.09mm	0.0028" / 0.07mm	0.0024" / 0.06mm
BGA pitch support	0.016" / 0.4mm	0.012" / 0.3mm	0.008" / 0.2mm
ENIG thickness	1.2µ" / 0.03µm	8µ" / 0.2µm	10µ" / 0.25µm
Electrolytic gold plating	20µ" / 0.5µm	50µ" / 1.27µm	60µ" / 1.5µm
Layer count	Up to 30 layers	Up to 50 layers	Up to 60 layers
Minimum mechanical drill	0.006" / 0.15mm	0.005" / 0.125mm	0.003" / 0.075mm
Maximum panel size	24.0" × 26.0" / 610 × 660mm	24.4" × 28.3" / 620 × 720mm	24.4" × 28.3" / 620 × 720mm
Maximum board thickness	0.189" / 4.8mm	0.236" / 6mm	0.275"+ / 7mm+
High aspect ratio support	Up to 24:1	Up to 30:1	Up to 35:1
Registration capability	0.003" / 0.075mm	0.0016"–0.002" / 0.04–0.05mm	0.0012"–0.0016" / 0.03–0.04mm
Special processes	Plugging, Back Drill, Laser Drill, 1+N+1 HDI	Plugging, Back Drill, Laser Drill, 2+N+2 HDI	Plugging, Back Drill, Laser Drill, 4+N+4 HDI

Professional note: Extreme capability depends on stack-up, material, copper weight, drill structure and production panel design. Please upload Gerber, stack-up and requirements for engineering review.

DFM Engineering Review

PCB engineering review before manufacturing

Before PCB production, our engineering workflow reviews Gerber data, drill files, spacing, annular ring, BGA escape routing and manufacturability risks to reduce production issues and improve first-pass yield.

PCB engineering DFM review for spacing and manufacturability

DFM rule checking

Engineering review identifies spacing violations, minimum trace width issues and manufacturability risks before production release.

PCB CAM engineering editing for BGA and high-density layouts

CAM editing and optimization

CAM engineers optimize production data for high-density BGA, drill alignment and panelization to support stable PCB fabrication.

PCB CAM operator reviewing production data before fabrication

CAM operator verification

CAM operation review confirms outline dimensions, tooling references, drill data and manufacturability settings before production release.

Focused Service Structure

Focused PCB service pages

These capability clusters are designed for high-intent buyer research, professional product display and international RFQ conversion.

HDI PCB

High-density interconnect PCB with microvia, fine-line routing and advanced buildup structures for compact, high-performance electronics.

View gallery · 8 photos

Multilayer PCB

Precision multilayer PCB fabrication supporting complex stackups, controlled impedance and high-density routing from prototype to production.

View gallery · 7 photos

Surface Finish & Solder Mask Color PCB

Flexible surface finish and solder mask color options including ENIG, HASL, OSP, ENEPIG and specialty finishes for production requirements.

View gallery · 16 photos

Heavy Copper PCB

Robust heavy copper boards for power electronics, high-current circuits and thermal management applications requiring reliable conductivity.

View gallery · 6 photos

Special Material PCB

Material-driven PCB solutions using RF, high-frequency, high-Tg and specialty substrates for thermal, signal and demanding environments.

View gallery · 10 photos

High Aspect Ratio PCB

Advanced drilling and plating capability for thick multilayer boards, deep vias and complex structures requiring stable hole reliability.

View gallery · 5 photos

Flex & Rigid-Flex PCB

Flexible and rigid-flex board solutions for compact, lightweight and space-constrained electronics with reliable dynamic interconnection.

View gallery · 5 photos

Copper & Aluminum Base PCB

Thermal-management PCB solutions with copper and aluminum base structures for LED, power supply and high-heat applications.

View gallery · 6 photos

Capability Download

Download PCB / SMT process capability PDFs

Receive bilingual PCB and SMT capability documents for supplier qualification, engineering evaluation and RFQ preparation.

Engineering Topic Cluster

PCB focused capability pages

Each focused capability page explains practical manufacturing requirements and guides buyers toward a more accurate RFQ.