
3D SPI
Solder paste volume and offset control before SMT placement.
Inspection, testing and process control designed for high-reliability PCBA production.

AOI, SPI, X-Ray, ICT and operator review are highlighted on the Quality page to show practical process control and high-reliability PCBA verification.

Solder paste volume and offset control before SMT placement.

Automated optical inspection for post-reflow assembly defects.

Operator review confirms AOI findings and improves process feedback for stable PCBA quality.

Hidden solder joint verification for BGA, QFN and complex packages.

Electrical connectivity and component-level test support.

Firmware loading and fixture-based verification support customer-specific PCBA delivery requirements.

Functional verification confirms product behavior and reduces delivery risk before shipment.
Operator inspection, rework review and protective packing demonstrate practical quality management beyond equipment lists.

Solder paste measurement before placement reduces soldering defects at the source.

Hidden solder-joint review supports BGA/QFN reliability confirmation.

Operator inspection supports workmanship confirmation during SMT assembly.

Reflow process control improves solder joint consistency and reliability.

Engineering review and repair support strengthen corrective action capability.

Anti-static protective packaging reduces handling and shipment risk.
ISO 9001, ISO 14001 and UL recognition support supplier qualification, quality assurance and international sourcing confidence.