SMT Production Line
A real SMT production line demonstrates placement capacity, process discipline and stable assembly control for 01005, fine-pitch IC and BGA projects.
SMT Assembly Capability
Precision SMT assembly, inspection, repair and testing support for demanding PCBA projects.
SMT Capability
01005 components to advanced repair support
- 01005 Components
- BGA Assembly
- DIP Assembly
- AOI Inspection
- X-Ray Inspection
- Conformal Coating
- ICT Support
- VIP PAD Repair
- PCB & IC Reballing
- Socket Replacement
- Programming & Test
SMT Process Capability
SMT process capability table
YourPCB provides a transparent SMT capability overview covering board size, SPI, precision placement, reflow, inspection and engineering support to help buyers evaluate assembly feasibility before RFQ.
| Process Category | Item | Standard Capability | Advanced Capability | Engineering Notes |
|---|---|---|---|---|
| PCB Size Limits | Minimum PCB Size | 50 x 50 mm | 30 x 30 mm | Panelization is recommended below this size for stable production. |
| PCB Size Limits | Maximum PCB Size | 460 x 460 mm | 460 x 700 mm | Supports large-format boards such as server boards and LED strip boards. |
| PCB Size Limits | PCB Thickness Range | 0.4 mm - 3.0 mm | 0.2 mm - 6.0 mm | Covers ultra-thin FPC and thick multilayer assemblies. |
| Solder Paste Printing (SPI) | Minimum Stencil Printing Pitch | 0.40 mm | 0.30 mm | Critical for precise solder paste control on fine-pitch components. |
| Solder Paste Printing (SPI) | 3D SPI Solder Paste Inspection | Available (area / volume / height / bridging) | Available (closed-loop feedback to printer) | Inline inspection after printing helps prevent a high percentage of soldering defects. |
| SMT Placement Capability | Minimum Chip Component | 0402 (1005 Metric) | 01005 | Supports miniaturized assemblies for wearable and compact electronics. |
| SMT Placement Capability | Maximum Mountable Component | 45 x 45 mm | 150 x 50 mm (長連接器) | Covers large or odd-form components and connectors. |
| SMT Placement Capability | Minimum Lead Pitch (QFP) | 0.40 mm | 0.30 mm | Supports fine-pitch IC placement accuracy. |
| SMT Placement Capability | Minimum Ball Pitch (BGA) | 0.50 mm | 0.25 mm | Defines process capability for BGA and CSP packages. |
| SMT Placement Capability | Placement Accuracy (3 sigma) | ± 40 um | ± 30 um | Supports high-precision packages with advanced alignment control. |
| Reflow Soldering | Reflow Heating Zones | 8 溫區 | 10 溫區 | More heating zones enable more accurate thermal profile control. |
| Reflow Soldering | Nitrogen Reflow Soldering | No / optional | Line support (N2 <= 500 ppm) | Reduces oxidation during lead-free soldering and improves solderability. |
| Reflow Soldering | Double-Sided Reflow Process | Supported | Supported (including adhesive fixing for second reflow) | Supports process control when heavy components are mounted on both sides. |
| Quality Inspection (QC) | 3D AOI Inspection | Available (3D optical inspection) | Available (full-line 3D AOI) | Inspects missing parts, polarity, wrong parts and insufficient solder. |
| Quality Inspection (QC) | X-Ray Inspection | Available (offline sampling inspection) | Available (3D CT X-Ray / automated inspection) | Used to inspect BGA voiding and hidden solder-joint defects. |
| Quality Inspection (QC) | First Article Inspection (FAI) | Manual multimeter measurement | Automatic FAI system (LCR comparison) | Prevents incorrect reel loading during line setup. |
| Quality Inspection (QC) | Electrical Functional Test | Fixture test (FCT) | FCT + flying probe + ICT circuit test | Open/short and functional verification according to customer specifications. |
| Production & Engineering Support | Special Process Capability | Lead-free process | Underfill / dispensing process | Improves BGA vibration resistance and moisture/corrosion protection. |
| Production & Engineering Support | Fast Prototype Build | 3 - 4 days | 24 - 48 hours | Fast response for NPI and prototype phases. |
| Production & Engineering Support | Production Volume Flexibility | Small to medium-volume production | Prototype to mass production | Flexible line changeover from prototype to volume production. |
| Production & Engineering Support | DFM Engineering Review | Basic manufacturability review | Full DFM optimization report | Identifies component opening, pad and manufacturability issues before production. |
SMT Process Control
Inspection data and operator judgment behind every build
YourPCB integrates 3D SPI, 3D AOI, X-Ray and printing process control to verify solder paste quality, placement condition and hidden solder-joint reliability throughout SMT production.
3D SPI Solder Paste Inspection
Controls paste volume, area, height and offset before placement to improve first-pass yield.
3D AOI Review
Confirms polarity, missing parts, solder shape and placement condition after reflow.
X-Ray Inspection
Verifies BGA, QFN and hidden solder joints that cannot be confirmed visually.
Printing Setup
Stable stencil alignment and printing setup are the foundation of high-reliability SMT assembly.
Process
SMT assembly workflow
BOM Review
Stencil
Solder Paste
Pick & Place
Reflow
AOI / X-Ray
Test
Programming & Functional Test
Programming and functional verification before shipment
YourPCB supports assembly validation, fixture-based testing and customer-specific verification beyond SMT placement, helping customers reduce risk before shipment.
Programming Test Setup
Fixture-based programming and test setup supports firmware loading, interface verification and repeatable customer-specific PCBA validation.
Functional Test Operation
Functional test operation verifies product behavior under real operating conditions and helps reduce field failure risk before delivery.
Capability Download
Download PCB / SMT process capability PDFs
Receive bilingual PCB and SMT capability documents for supplier qualification, engineering evaluation and RFQ preparation.
Engineering Topic Cluster
SMT focused capability pages
Each focused SMT capability page explains inspection, assembly or test requirements to help buyers prepare a clearer RFQ package.
AOI Inspection
Engineering-focused capability content for evaluation and quotation preparation.
SPI Inspection
Engineering-focused capability content for evaluation and quotation preparation.
X-Ray Inspection
Engineering-focused capability content for evaluation and quotation preparation.
BGA Assembly
Engineering-focused capability content for evaluation and quotation preparation.
ICT Testing
Engineering-focused capability content for evaluation and quotation preparation.
VIP Pad Repair
Engineering-focused capability content for evaluation and quotation preparation.