01SPI
3D SPI Solder Paste Inspection
Controls solder paste volume, height, area and offset before placement to reduce printing-related defects.
SMT Factory & Equipment
A professional SMT manufacturing environment built for 01005 placement, BGA assembly, inspection, ICT support, programming, testing, cleaning and conformal coating.
SMT Process
Equipment-driven SMT process control
From solder paste printing to inspection and final reliability processes, each equipment module is arranged to support stable yield, traceability and international customer expectations.
- 01Printing
- 023D SPI
- 03SMT Placement
- 04Nitrogen Reflow
- 053D AOI / X-Ray
- 06ICT / Test
- 07Cleaning / Coating
- 08Traceability
Quality Inspection System
AOI, SPI, X-Ray and ICT inspection capability
These inspection systems and operator review checkpoints are placed at key SMT stations to control solder paste quality, post-reflow assembly defects, hidden BGA solder joints, electrical connectivity and corrective feedback before shipment.
02AOI
3D AOI Automated Optical Inspection
Detects missing parts, polarity, solder bridges, insufficient solder and placement accuracy after reflow.
03AOI Review
AOI Review Operation
Real AOI review operation supports defect confirmation, false-call reduction and closed-loop feedback for SMT process improvement.
04X-Ray
X-Ray BGA Inspection
Verifies hidden solder joints for BGA, QFN, LGA and high-density assemblies where optical inspection is limited.
05ICT
ICT Electrical Test Support
Checks circuit connectivity, component values and assembly defects to strengthen final shipment quality assurance.
Equipment Gallery
SMT equipment capability display
A well-controlled SMT line requires equipment capability, process discipline and inspection coverage at every critical stage. YourPCB combines printing, placement, reflow, AOI, SPI, X-Ray and test support to deliver reliable PCBA production for demanding applications.
01Inspection
3D AOI Operator Verification
3D AOI operator verification combines automated optical measurement with human review to confirm solder joints, component polarity, placement accuracy and process feedback.
02Inspection
3D SPI Solder Paste Control
3D SPI operation measures solder paste height, area, volume and offset immediately after printing to stop paste defects before placement.
03Inspection
X-Ray Hidden Solder Joint Analysis
X-Ray operation supports BGA, QFN and high-density package inspection where hidden solder joints cannot be verified by visual inspection.
04Printing
Solder Paste Printing Setup
Printer setup and stencil alignment control are key process steps for solder paste consistency, fine-pitch assembly and stable SMT yield.
05Printing
Automatic Solder Paste Printer
High-repeatability solder paste printing supports stable SMT yield from the first process step.
06Printing
Automatic Solder Paste Printer Line
Automated stencil printing improves paste volume consistency for fine-pitch and high-density PCBA.
07Printing
Semi-Automatic Printer
Flexible printing support for engineering samples, prototypes and mixed-volume production.
08Inspection
3D SPI Solder Paste Inspection
3D SPI measures solder paste volume, height, area and offset before placement to prevent upstream printing defects from entering mass production.
09Placement
Yamaha SMT Placement
High-speed placement capability for 01005 components, fine-pitch ICs and high-density assemblies.
10Placement
Yamaha Placement Line
Precision placement process supports stable production from prototype builds to volume manufacturing.
11Placement
Samsung SMT Placement
Additional SMT placement capacity supports flexible scheduling and diversified production requirements.
12Reflow
Nitrogen Reflow Oven
Nitrogen reflow helps improve solder joint reliability and oxidation control during assembly.
13Reflow
Nitrogen Reflow Process
Controlled reflow profiling supports repeatable soldering quality for complex PCB assemblies.
14Inspection
3D AOI Automated Optical Inspection
3D AOI verifies component presence, polarity, solder quality, bridge defects and placement accuracy after reflow for stable SMT quality control.
15Inspection
X-Ray BGA Inspection
X-Ray inspection supports hidden solder joint analysis for BGA, QFN, LGA and high-density packages where visual inspection cannot verify internal solder quality.
16Material Control
X-Ray Component Counter
Non-destructive component counting improves inventory accuracy and material traceability.
17Testing
ICT Test Equipment
ICT support verifies circuit connectivity, component values and assembly defects, helping customers reduce functional risk before shipment.
18Inspection
First Article Inspection
First article verification strengthens process setup control before production release.
19Measurement
2.5D Measurement
Dimensional measurement supports process verification and quality assurance for precision assemblies.
20Measurement
Board Thickness Measurement
Board thickness measurement helps control mechanical fit and production consistency.
21Measurement
V-Cut Residual Thickness Measurement
V-cut residual thickness control supports stable depaneling and product reliability.
22Traceability
UV Laser Marking
Laser marking enables durable identification, traceability and lot control for PCB assemblies.
23DIP Support
Selective Soldering
Selective soldering supports through-hole components while protecting sensitive SMT areas.
24DIP Support
Automatic Soldering
Automated soldering improves repeatability for connectors, wires and through-hole processes.
25Rework
BGA Rework Station
Professional BGA rework capability supports repair, reballing and engineering validation.
26Cleaning
PCB Cleaning Machine
Board surface cleaning helps reduce particles and contamination before critical process steps.
27Cleaning
PCB Cleaning System
Cleaning equipment supports flux residue control and improved long-term product reliability.
28Cleaning
PCBA Cleaning System
PCBA cleaning supports reliability requirements for demanding industrial and electronic applications.
29Conformal Coating
5-Axis Conformal Coating
Automated conformal coating protects assemblies from moisture, dust and harsh environments.
SMT Production Control
SMT production, reflow, inspection and shipment control
YourPCB presents real SMT production, nitrogen reflow, operator inspection, PCBA rework and packaging control to show the process discipline behind reliable assembly delivery.
01SMT Line
SMT Production Line
SMT line operation reflects YourPCB’s placement capability, process discipline and production stability for high-reliability PCBA programs.
02SMT Line
SMT Line Operation
Line-side production control supports efficient scheduling, stable throughput and consistent assembly quality.
03Reflow
Nitrogen Reflow Soldering
Controlled nitrogen reflow improves solder joint consistency and reduces oxidation risk for high-reliability PCBA.
04Reflow
Reflow Process Control
Reflow profile management supports repeatable soldering quality for fine-pitch, BGA and high-density assemblies.
05IPQC
In-Process Quality Inspection
Operator inspection adds human verification to automated inspection systems and strengthens practical quality control.
06Quality
Manual Visual Inspection
Skilled quality personnel review workmanship details, solder joints and assembly appearance during production.
07Quality
Quality Verification
Process verification helps ensure that PCBA products meet customer requirements before shipment.
08Rework
PCBA Rework Support
Engineering rework support enables corrective action, repair validation and process improvement when required.
09Rework
Repair and Maintenance Review
Professional review supports reballing, socket replacement and customer-specific repair requirements.
10Packaging
ESD Protective Packaging
Anti-static packaging reduces handling risk and protects assembled boards during storage and transportation.
11Packaging
Tray Packaging
Tray packing supports safe separation and handling protection for PCBA products before shipment.
12Shipment
Final Shipment Packaging
Final packing is arranged to protect finished PCB assemblies during domestic and international delivery.
13Shipment
Boxing and Delivery Preparation
Shipment preparation supports traceability, product protection and smooth delivery to customers.
14Programming
Programming & Test Setup
Fixture-based programming and testing helps verify firmware loading, interfaces and customer-specific electrical behavior before delivery.
15FCT
Functional Test Operation
Functional verification confirms real product behavior and strengthens shipment confidence for PCBA projects.
Engineering Support
Build your next PCBA project with YourPCB
Send Gerber, BOM and Pick & Place files for SMT assembly review, DFM/DFA feedback and production planning.