From solder paste printing to reflow
A stable reflow process starts before the PCB enters the oven. Stencil design, solder paste type, printing pressure, PCB support, placement accuracy and component thermal sensitivity all affect the final solder joint.
Why SPI and AOI matter
SPI checks solder paste volume, height, area and offset before placement. AOI verifies placement and solder conditions after reflow. Together, they provide process evidence that helps reduce repeated defects and improve production stability.
Reflow profile control
The reflow profile must consider preheat, soak, time above liquidus, peak temperature and cooling rate. A profile that works for one board may not work for another because board thickness, copper distribution and component mass are different.
YourPCB process value
YourPCB links SPI, SMT placement, reflow, AOI, X-Ray and functional testing into a controlled production flow so that customers receive not only assembled boards, but manufacturing evidence and quality confidence.
RFQ preparation checklist
A clear RFQ package allows the engineering team to identify manufacturability risk earlier and respond with more accurate technical feedback. Before sending a request, prepare production data, target quantity, delivery expectations and quality requirements as completely as possible.
- Gerber / ODB++ data and fabrication drawing
- BOM, Pick & Place and assembly drawing when SMT is required
- Stack-up, impedance targets and material requirements
- Inspection, programming, ICT / FCT and packaging requirements
Why customers work with YourPCB
YourPCB combines engineering review, controlled PCB fabrication, SMT assembly, inspection, testing and responsive communication. The goal is not only to deliver boards, but to help customers reduce technical uncertainty before production and improve long-term manufacturing reliability.