Control before placement
SPI helps detect insufficient, excessive, offset or bridging solder paste before components are mounted.
SPI Solder Paste Inspection
Solder paste quality is one of the earliest control points in SMT assembly reliability.
Focused Technical Capability
Improve first-pass yield
By controlling printing quality early, SPI reduces downstream defects and supports stable reflow results.
- 3D solder paste volume inspection
- Stencil printing process control
- Defect prevention before SMT placement
- Supports high-density assemblies
Engineering Notes
What buyers should prepare
Gerber / ODB++, stack-up, BOM, Pick & Place, target quantity, surface finish, reliability requirement and test criteria allow YourPCB engineering team to provide faster DFM feedback and a more accurate quotation.
DFM Review
Early manufacturability review reduces production risk before tooling and mass production.
Quality Control
Inspection planning connects material, process, AOI / X-Ray / ICT and final verification requirements.
RFQ Response
Complete engineering files help shorten quotation lead time and clarify cost drivers.
Engineering FAQ
Questions buyers ask before RFQ
These answers help engineering and sourcing teams prepare a more accurate PCB / SMT quotation package.
What information should be provided for review?
Please provide Gerber or ODB++, stack-up, BOM, Pick & Place, drawings, quantity, surface finish, test requirements and target lead time.
How does YourPCB reduce production risk?
Our process combines DFM / DFA review, CAM engineering, controlled manufacturing, AOI / SPI / X-Ray inspection and programming or functional test when required.