
Process choice linked to assembly outcome
Finish and solder mask selection should be aligned with component type, shelf life, lead-free process and reliability needs.
Surface finish selection affects solderability, storage life, assembly yield and product reliability.

Finish and solder mask selection should be aligned with component type, shelf life, lead-free process and reliability needs.
YourPCB helps customers evaluate ENIG, HASL, OSP and solder mask options based on manufacturing and assembly goals.
Gerber / ODB++, stack-up, BOM, Pick & Place, target quantity, surface finish, reliability requirement and test criteria allow YourPCB engineering team to provide faster DFM feedback and a more accurate quotation.
Early manufacturability review reduces production risk before tooling and mass production.
Inspection planning connects material, process, AOI / X-Ray / ICT and final verification requirements.
Complete engineering files help shorten quotation lead time and clarify cost drivers.
These answers help engineering and sourcing teams prepare a more accurate PCB / SMT quotation package.
Please provide Gerber or ODB++, stack-up, BOM, Pick & Place, drawings, quantity, surface finish, test requirements and target lead time.
Our process combines DFM / DFA review, CAM engineering, controlled manufacturing, AOI / SPI / X-Ray inspection and programming or functional test when required.