Engineering-driven capability
X-Ray inspection provides visual verification for solder joints that cannot be confirmed by surface inspection, helping reduce field failure risk.
X-Ray Inspection
X-Ray inspection evidence for BGA, QFN and reliability-critical PCBA assemblies.
Focused Capability
Why buyers choose YourPCB
- BGA / QFN solder joint verification
- Supports process review and failure analysis
- Strengthens high-reliability assembly control
- Integrated with AOI, SPI, ICT and functional test
RFQ Guidance
Files recommended for engineering review
Gerber / ODB++, BOM, Pick & Place, stack-up, quantity, surface finish and test requirements help the team respond faster and more accurately.
Engineering FAQ
Questions buyers ask before RFQ
These answers help engineering and sourcing teams prepare a more accurate PCB / SMT quotation package.
What information should be provided for review?
Please provide Gerber or ODB++, stack-up, BOM, Pick & Place, drawings, quantity, surface finish, test requirements and target lead time.
How does YourPCB reduce production risk?
Our process combines DFM / DFA review, CAM engineering, controlled manufacturing, AOI / SPI / X-Ray inspection and programming or functional test when required.