Engineering-driven capability
BGA assembly quality is verified through controlled SMT process parameters, reflow profile management and X-Ray inspection evidence for hidden solder joints.
BGA Assembly
Precision BGA placement with X-Ray verification for hidden solder-joint reliability.
Focused Capability
Why buyers choose YourPCB
- BGA and fine-pitch component assembly
- X-Ray inspection for hidden solder joints
- PCB & IC reballing support
- Programming and functional test available
RFQ Guidance
Files recommended for engineering review
Gerber / ODB++, BOM, Pick & Place, stack-up, quantity, surface finish and test requirements help the team respond faster and more accurately.
Engineering FAQ
Questions buyers ask before RFQ
These answers help engineering and sourcing teams prepare a more accurate PCB / SMT quotation package.
What information should be provided for review?
Please provide Gerber or ODB++, stack-up, BOM, Pick & Place, drawings, quantity, surface finish, test requirements and target lead time.
How does YourPCB reduce production risk?
Our process combines DFM / DFA review, CAM engineering, controlled manufacturing, AOI / SPI / X-Ray inspection and programming or functional test when required.